Heat sink, square, PCB, extruded, LED, 11 °C/W, SOT-32, TO-220, 29 mm, 25 mm, 37.5 mm

Heat sink, 21 °C/W, TO-220, 12.7 mm, 20 mm, 12.7 mm

Heat Sink, 12.9 °C/W, TO-218, TO-220, 16.6 mm, 38.1 mm, 16.26 mm

Heat Sink, 12.9 °C/W, TO-218, TO-220, 16.6 mm, 38.1 mm, 16.26 mm

Retention Spring, Clip Mount, 4 mm Thick, Stainless Steel, 18 mm x 15.5 mm

Heat Sink, TO-220/TO-3P, 6.2 °C/W, TO-3P, TO-220, 45 mm, 50.8 mm, 12.7 mm

Heat Sink, Extrusion Range- 1, 2.75 °C/W, 98.4 mm, 53.2 mm, 50 mm

Heat Sink, Ball Grid Array, Push Pin, 9 °C/W, BGA, 49 mm, 15 mm, 49 mm

Heat sink, PCB, for semiconductors, TO-6, 63 °C/W, TO-5, 9 mm, 12.7 mm

Heat sink, extruded, 0.4 °C/W, 300 mm, 40 mm, 100 mm

Transistor mounting pad, 3.18mm long, TO-18 package

Heat Sink, TO-220, 12 °C/W, TO-218, TO-220, TO-247, TO-248, 29 mm, 37.5 mm, 12 mm

Heat sink, TO-126

Heat sink, TO-3, Aluminum, Black

Heat Sink, TO-220, 26 °C/W, TO-220, 15 mm, 15.24 mm, 12.7 mm

Heat sink, square, PCB, extruded, LED, 8.5 K/W, SOT-32, TO-220, 21.45 mm, 19 mm, 50 mm

Heat Sink, Square, PCB, For Ball Grid Array, 18.5 °C/W, BGA, 27 mm, 10 mm, 27 mm

Heat sink, for board-level power semiconductors, 5.8 °C/W, TO-220, 34.9 mm, 25.4 mm, 12.7 mm

Heat Sink, TO-220/218, 3.7 °C/W, TO-218, TO-220, 50 mm, 28 mm, 75 mm

Fan/forced heat sink, hollow aggregate, 0.085 °C/W, 120 mm, 122 mm, 150 mm, 160 m3/h, 47 dBA