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374424B00035G
374424B00035GReference image

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Mfr. #:
374424B00035G
Mfr.:
Batch:
new
Description:
Heat Sink, Square, PCB, For Ball Grid Array, 20.3 °C/W, BGA, 27 mm, 18 mm, 27 mm
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Specifications
frequently asked question
Product AttributeAttribute Value
Thermal resistance 20.3°C/W
Coolable package BGA
External width - Metric 27mm
External height - Metric 18mm
Other product information

Advantage price,374424B00035G in stock can be shipped on the same day

In Stock: 3744
Qty.Unit PriceExt. Price
1+ $3.2721 $3.2721
100+ $3.2070 $320.7
250+ $3.1283 $782.075
500+ $3.0647 $1532.35
Enter Quantity:
Unit Price:
$0.47
Ext. Price:
$0.94
In Stock:
3744
Minimum:
1
MPQ:
1
Multiples:
1
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