Ruichips
Shenzhen Ruijun Semiconductor Co., Ltd. was established in 2009. It is a national high-tech enterprise engaged in the research and development, production and sales of silicon-based power semiconductors, third-generation semiconductors, and mixed analog and digital ICs. In response to the needs of the market and its own development, the company extended the industrial chain in 2019 to engage in the layout of wafer post-process and packaging and testing business. The current packaging forms include QFN, DFN, SOP, SSOP, SOT, TSSOP, TOLL, TO, RUPAK8*8, CLIP BOND, etc. Now it has gradually expanded to: wafer plating, wafer thinning, wafer back gold, wafer dicing, wafer testing, packaging, pin plating, test and IPM module, IGBT module, etc. The company is committed to creating the most influential one-stop wafer post-process to components (modules) and other manufacturing services in South China.