iC-Haus
iC-Haus develops and manufactures Application Specific Standard Products (ASSP), Application Specific Integrated Circuits (ASiC) and is a leading expert in monolithic mixed-signal circuits and microsystems. Our wafer backend, chip assembly and test facilities are located in Bodenheim near Frankfurt in central Europe. Our subcontracted wafer foundries and assemblers are located all over the world, ensuring reliable second-source products and deliveries. Quality engineering is established in international standards such as ISO9001. iC-Haus products are authorized for industrial, medical and automotive use and follow FMEA methods and safety requirements.