Bergquist
Henkels BERGQUIST® brand thermal management materials include a broad range of solutions that can be used to improve the reliability and heat dissipation of modern electronic devices. The companys BERGQUIST GAPPAD® gap-filling thermal interface materials (TIMs) are soft, conformable, pre-cut pads that reduce assembly stress while providing excellent thermal conductivity. Liquid BERGQUIST gap-filling material TIMs can be automatically filled and are ideal for applications requiring complex dimensions and/or high output. Its broad portfolio of thermal solutions also includes SILPAD® thermally conductive insulators, BONDPLY® thermally conductive adhesives, HIFLOW® phase change materials and TCLAD® insulated metal substrates (IMS®). Henkel acquired Bergquist in 2014, effectively expanding Henkels leadership in electronic materials development with state-of-the-art thermal management products. With involvement in nearly every phase of semiconductor packaging, electronic assembly, thermal management and structural assembly, Henkel is unmatched in its ability to provide comprehensive material solutions to top electronics companies.