TechNexion
TechNexion has invested heavily in the latest equipment to ensure we can design with extreme precision. Package-on-package technology enables components to be stacked on top of each other, enabling the production of system-level modules, embedded boards and single-board computers with a smaller footprint. The ability to enable these products to have a smaller footprint is particularly useful in mobile environments. We have also invested in high-speed equipment, which means designs with a large number of components will not become a bottleneck to your go-to-market goals. In addition, we have introduced a computerized barcode tracking system for each PCB. This system allows us to track not only the level of each component, but also the date, time and even the level of the machine operator, so we can instantly and accurately identify and resolve production problems.